Molex introduces MX-DaSH modular wire-to-wire connectors, the newest additions to its MX-DaSH family of data-signal hybrid ...
EMASS announced a strategic collaboration with Semtech to bring low-power Edge AI solutions integrated with LoRaWAN ...
ERC has awarded a Consolidator Grant for SuperQold project, focuses on scaling superconducting qubit readout with millikelvin (mK) detection.
Nissan Technical Centre Europe (NTCE) and Sonatus have announced a development partnership to accelerate the vehicle development process.
Kyocera and Rohde & Schwarz will showcase the characterisation of Kyocera’s novel phased array antenna module at CES 2026 in Las Vegas, NV.
Littelfuse, Inc. announced the launch of the TPSMB Asymmetrical Series TVS Diodes (TPSMB2412CA, TPSMB2616CA, TPSMB2818CA, TPSMB3018CA). These first-to-market devices are specifically designed for 12V ...
Belden has partnered with QSECDEF to accelerate the development of quantum-secure networking and critical system resilience.
Littelfuse has unveiled a new compact solid-state relay designed to meet growing demand for fast, low-power switching ...
Imec has demonstrated the first wafer-scale fabrication of solid-state nanopores using extreme ultraviolet (EUV) lithography.
Fraunhofer IPMS is using AI-driven sensors to continuously monitor soil, water, and hydrogen infrastructure in the Lusatia ...
Inelco Hunter, a franchised distributor for Amphenol, is pleased to confirm immediate availability of CONEC M8 and M12 sensor ...
The latest revision of the ESD standard has been released, bringing significant updates, new test parameters, and specific ...
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